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QSIL550灌注封裝膠 Encapsulants & Potting

FEATURE(產品簡介)
  • 1:1 MIX RATIO
  • THERMALLY CONDUCTIVE
  • SOLVENT FREE
  • UL94 V-0 APPROVED FILE NO. E205830
DESCRIPTION(產品簡介)

2-PART ADDITION CURE ENCAPSULANT

索取樣品
參數表PARAMETERS

  • CODE

    QSil550

  • FEATURE 1

    1:1 Mix ratio

  • FEATURE 2

    Thermally conductive

  • FEATURE 3

    Solvent free

  • FEATURE 4

    UL94 V-0 approved file No. E205830

  • APPEARANCE

    Viscous liquid

  • TEST CONDITIONS

    After 7 hour at 150°C

  • COLOUR

    Grey

  • COLOUR A PART

    Beige

  • COLOUR b

    Black

  • SG

    1.41

  • SG a part

    1.41

  • SG b part

    1.41

  • MIN WORKING TEMP - °C

    -55 °C

  • MAX WORKING TEMP +°C

    275°C

  • FDA

    No

  • SHELF LIFE

    24mths

  • MAX STORAGE TEMPERATURE °C

    30 °C

  • PACK TYPE

    2-Part Kit

  • MIX RATIO

    1:1

  • RHEOLOGY

      Viscous Liquid

  • VISCOSITY A-PART MPAS

    4000mPas

  • VISCOSITY b-PART MPAS

    4000 mPas

  • VISCOSITY mixed PART MPAS

    4000 mPas

  • NON CORROSIVE

    Yes

  • CURE TYPE

    Addition

  • RTV OR HEAT CURE

    Heat Accelerated RTV

  • SELF BONDING

    NO

  • UL 94V-0

    YES

  • DURO SHORE a

    55

  • TENSILE MPA

    3.52 MPa

  • ELONGATION %

    150 %

  • TEAR KN/M

    5.73 kN/m

  • LINEAR SHRINKAGE %

    0.1 %

  • CTE VOLUMETRIC PPM/°C

    700 ppm/°C

  • CTE LINEAR PPM/°C

    233 ppm/°C

  • DIELECTRIC CONSTANT @ 1KHZ

    3.12

  • DIELECTRIC STRENGTH KV/MM

    >17.5 kV/mm

  • DISSIPATION FACTOR @ 1KHZ

    0.003

  • MAX CURE HRS @ 25 °C

    24HRS

  • MAX CURE mins @ 100 °C

    7mins

  • THERMAL CONDUCTIVITY W/MK

    >0.97 W/mK

  • VOLUME RESISTIVITY OHMS CM

    1.4E+15 ohms cm

  • POT LIFE MINS

    130mins

    •