SE2010灌注封裝膠 Encapsulants & Potting
FEATURE(產品簡介)
- THERMALLY CONDUCTIVE
- UL94 V0 APPROVED
- CONTROLLED VOLATILE CONTENT
- NON SLUMPING
DESCRIPTION(產品簡介)
SILCOTHERM 2 PART SILICONE GAP FILLER
參數表PARAMETERS
- CODE
SE2010
- FEATURE 1
Thermal Conductive
- FEATURE 2
UL94 V0 Approved
- FEATURE 3
Controlled volatile content
- FEATURE 4
Non slumping
- APPEARANCE
Thixotropic Paste
- TEST CONDITIONS
After 7 days cure at 23°+/-2°C and 50+/-5% humidity
- COLOUR
Black
- COLOUR A PART
Pale Grey
- COLOUR b
Black
- SG
2.3
- MIN WORKING TEMP - °C
-60 °C
- MAX WORKING TEMP +°C
200°C
- FDA
No
- SHELF LIFE
9 mths
- MAX STORAGE TEMPERATURE °C
25 °C
- PACK TYPE
2-Part Kit
- MIX RATIO
1:1
- RHEOLOGY
Paste
- VISCOSITY A-PART MPAS
248000Pas
- VISCOSITY b-PART MPAS
390000 mPas
- VISCOSITY mixed PART MPAS
320000mPas
- NON CORROSIVE
Yes
- CURE TYPE
Addition
- RTV OR HEAT CURE
Heat Accelerated RTV
- SELF BONDING
no
- UL 94V-0
Yes
- DURO SHORE 00
50
- lINEAR SHRINKAGE
0.1%
- MAX CURE HRS @ 25 °C
5HRS
- MAX CURE MINS @ 100 °C
2mins
- CTE VOLUMETRIC PPM/°C
558 ppm/°C
- CTE LINEAR PPM/°C
186 ppm/°C
- DIELECTRIC CONSTANT @ 1KHZ
>4.9
- DISSIPATION FACTOR @ 1KHZ
0.006
- THERMAL CONDUCTIVITY W/MK
1.7 W/mK
- POT LIFE MINS
60mins
- VOLUME RESISTIVITY OHMS CM
9.62E+12 ohms cm